{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1362262943942470656.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.1016/s0026-2714(02)00348-7"}},{"identifier":{"@type":"URI","@value":"https://api.elsevier.com/content/article/PII:S0026271402003487?httpAccept=text/xml"}},{"identifier":{"@type":"URI","@value":"https://api.elsevier.com/content/article/PII:S0026271402003487?httpAccept=text/plain"}}],"dc:title":[{"@value":"The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications"}],"creator":[{"@id":"https://cir.nii.ac.jp/crid/1382262943942470657","@type":"Researcher","foaf:name":[{"@value":"C.Y Yin"}]},{"@id":"https://cir.nii.ac.jp/crid/1382262943942470659","@type":"Researcher","foaf:name":[{"@value":"M.O Alam"}]},{"@id":"https://cir.nii.ac.jp/crid/1382262943942470660","@type":"Researcher","foaf:name":[{"@value":"Y.C Chan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382262943942470658","@type":"Researcher","foaf:name":[{"@value":"C Bailey"}]},{"@id":"https://cir.nii.ac.jp/crid/1382262943942470656","@type":"Researcher","foaf:name":[{"@value":"Hua Lu"}]}],"publication":{"publicationIdentifier":[{"@type":"PISSN","@value":"00262714"}],"prism:publicationName":[{"@value":"Microelectronics Reliability"}],"dc:publisher":[{"@value":"Elsevier BV"}],"prism:publicationDate":"2003-04","prism:volume":"43","prism:number":"4","prism:startingPage":"625","prism:endingPage":"633"},"reviewed":"false","dc:rights":["https://www.elsevier.com/tdm/userlicense/1.0/"],"url":[{"@id":"https://api.elsevier.com/content/article/PII:S0026271402003487?httpAccept=text/xml"},{"@id":"https://api.elsevier.com/content/article/PII:S0026271402003487?httpAccept=text/plain"}],"createdAt":"2003-04-07","modifiedAt":"2024-12-11","relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1360003449885091328","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump"}]},{"@id":"https://cir.nii.ac.jp/crid/1390282679226258048","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Contact Resistance of the Chip-on-Glass Bonded 48Sn–52In Solder Joint"},{"@value":"Contact Resistance of the Chip-on-Glass Bonded 48Sn&ndash;52In Solder Joint"}]},{"@id":"https://cir.nii.ac.jp/crid/1390282679229590656","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I. Flip-Chip Bonding on Rigid Substrates"},{"@value":"Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates(Part 1)Flip-Chip Bonding on Rigid Substrates"}]},{"@id":"https://cir.nii.ac.jp/crid/1390282679230100096","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Thermoelectric Power-Generation Characteristics of a Thin-Film Device Processed by the Flip-Chip Bonding of Bi<sub>2</sub>Te<sub>3</sub> and Sb<sub>2</sub>Te<sub>3</sub> Thin-Film Legs Using an Anisotropic Conductive Adhesive"},{"@value":"Thermoelectric Power-Generation Characteristics of a Thin-Film Device Processed by the Flip-Chip Bonding of Bi₂Te₃ and Sb₂Te₃ Thin-Film Legs Using an Anisotropic Conductive Adhesive"}]}],"dataSourceIdentifier":[{"@type":"CROSSREF","@value":"10.1016/s0026-2714(02)00348-7"},{"@type":"CROSSREF","@value":"10.1143/jjap.50.06gm05_references_DOI_Q38XFPmtGYnrnDbet6S1LDBOnuR"},{"@type":"CROSSREF","@value":"10.7567/jjap.50.06gm05_references_DOI_Q38XFPmtGYnrnDbet6S1LDBOnuR"},{"@type":"CROSSREF","@value":"10.2320/matertrans.m2017065_references_DOI_Q38XFPmtGYnrnDbet6S1LDBOnuR"},{"@type":"CROSSREF","@value":"10.2320/matertrans.46.1042_references_DOI_Q38XFPmtGYnrnDbet6S1LDBOnuR"},{"@type":"CROSSREF","@value":"10.2320/matertrans.m2015236_references_DOI_Q38XFPmtGYnrnDbet6S1LDBOnuR"}]}