著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Takayuki Ohba,Bumpless Through-Dielectrics-Silicon-Via (TDSV) Technology for Wafer-Based Three-Dimensional Integration (3DI),ECS Transactions,1938-5862,The Electrochemical Society,2012-03-16,44,1,827-840,https://cir.nii.ac.jp/crid/1362262945407125632,https://doi.org/10.1149/1.3694403