著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Dong Uk Lee and Kyung Whan Kim and Kwan Weon Kim and Hongjung Kim and Ju Young Kim and Young Jun Park and Jae Hwan Kim and Dae Suk Kim and Heat Bit Park and Jin Wook Shin and Jang Hwan Cho and Ki Hun Kwon and Min Jeong Kim and Jaejin Lee and Kun Woo Park and Byongtae Chung and Sungjoo Hong,25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV,2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC),,IEEE,2014-02,,,432-433,https://cir.nii.ac.jp/crid/1362544419365214336,https://doi.org/10.1109/isscc.2014.6757501