{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1362544420106450688.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.1039/c6tc04360g"}},{"identifier":{"@type":"URI","@value":"http://pubs.rsc.org/en/content/articlepdf/2017/TC/C6TC04360G"}},{"identifier":{"@type":"HANDLE","@value":"2115/65126"}}],"dc:title":[{"@value":"Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature"}],"description":[{"type":"abstract","notation":[{"@value":"<p>Decomposable polymer was used for low temperature sintering of Cu fine particles for conductive films.</p>"}]}],"creator":[{"@id":"https://cir.nii.ac.jp/crid/1382544420106450691","@type":"Researcher","foaf:name":[{"@value":"Yingqiong Yong"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450690","@type":"Researcher","foaf:name":[{"@value":"Mai Thanh Nguyen"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450692","@type":"Researcher","foaf:name":[{"@value":"Tetsu Yonezawa"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450693","@type":"Researcher","foaf:name":[{"@value":"Takashi Asano"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450695","@type":"Researcher","foaf:name":[{"@value":"Masaki Matsubara"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450688","@type":"Researcher","foaf:name":[{"@value":"Hiroki Tsukamoto"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450694","@type":"Researcher","foaf:name":[{"@value":"Ying-Chih Liao"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450816","@type":"Researcher","foaf:name":[{"@value":"Tengfei Zhang"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450689","@type":"Researcher","foaf:name":[{"@value":"Shigehito Isobe"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1382544420106450817","@type":"Researcher","foaf:name":[{"@value":"Yuki Nakagawa"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Faculty of Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]}],"publication":{"publicationIdentifier":[{"@type":"PISSN","@value":"20507526"},{"@type":"EISSN","@value":"20507534"}],"prism:publicationName":[{"@value":"Journal of Materials Chemistry C"}],"dc:publisher":[{"@value":"Royal Society of Chemistry (RSC)"}],"prism:publicationDate":"2017","prism:volume":"5","prism:number":"5","prism:startingPage":"1033","prism:endingPage":"1041"},"reviewed":"false","dcterms:accessRights":"http://purl.org/coar/access_right/c_abf2","url":[{"@id":"http://pubs.rsc.org/en/content/articlepdf/2017/TC/C6TC04360G"}],"createdAt":"2016-11-29","modifiedAt":"2024-04-17","foaf:topic":[{"@id":"https://cir.nii.ac.jp/all?q=570","dc:title":"570"}],"relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1360572092626143104","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics"}]},{"@id":"https://cir.nii.ac.jp/crid/1360848654803294592","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Contribution of Ligand Oxidation Products to High Durability of Copper Films Prepared from Low‐Sintering‐Temperature Copper Ink on Polymer Substrates"}]},{"@id":"https://cir.nii.ac.jp/crid/1361131415899478272","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Enhanced flexibility and environmental durability of copper electrode produced with conductive ink containing silane coupling agents with diamine and ether spacer"}]},{"@id":"https://cir.nii.ac.jp/crid/1361694366495653376","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"The rise of conductive copper inks: challenges and perspectives"}]},{"@id":"https://cir.nii.ac.jp/crid/1362257544137099392","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light"}]},{"@id":"https://cir.nii.ac.jp/crid/1390001288065505408","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"ja","@value":"電子材料への応用のためのナノ粒子の表面デザイン"},{"@language":"en","@value":"Surface Design and Functional Prediction of Inorganic Nanoparticles for Electronic Material Applications"},{"@language":"ja-Kana","@value":"デンシ ザイリョウ エ ノ オウヨウ ノ タメ ノ ナノ リュウシ ノ ヒョウメン デザイン"}]},{"@id":"https://cir.nii.ac.jp/crid/1390301949907859200","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Review: Copper Fine Particle/Nanoparticle-Based Sintering Joining Material"},{"@language":"ja","@value":"レビュー：銅微粒子・ナノ粒子を用いた焼結性接合材料"}]},{"@id":"https://cir.nii.ac.jp/crid/1390303321513000832","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Review: Copper Fine Particle/Nanoparticle-Based Sintering Joining Material"}]},{"@id":"https://cir.nii.ac.jp/crid/1390854882571918592","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Copper Materials for Low Temperature Sintering"}]}],"dataSourceIdentifier":[{"@type":"CROSSREF","@value":"10.1039/c6tc04360g"},{"@type":"OPENAIRE","@value":"doi_dedup___::7c5c7afcf3eb530be69a14e39aa15a30"},{"@type":"CROSSREF","@value":"10.4164/sptj.55.325_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.2320/jinstmet.j2023042_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.2320/matertrans.mt-n2021004_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.3390/nano10091689_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.2320/matertrans.mt-m2024157_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.1002/adem.201700259_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.1007/s10854-019-01571-y_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.1016/j.apmt.2019.100451_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"},{"@type":"CROSSREF","@value":"10.3390/nano9081071_references_DOI_A5L4AReVQZQGf8D6qgm7qBDMoMj"}]}