著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
John H. Lau and Ming Li and Margie Li Qingqian and Tony Chen and Iris Xu and Qing Xiang Yong and Zhong Cheng and Nelson Fan and Eric Kuah and Zhang Li and Kim Hwee Tan and Yiu-Ming Cheung and Eric Ng and Penny Lo and Wu Kai and Ji Hao and Koh Sau Wee and Jiang Ran and Cao Xi and Rozalia Beica and Sze Pei Lim and N. C. Lee and Cheng-Ta Ko and Henry Yang and Yu-Hua Chen and Mian Tao and Jeffery Lo and Ricky S. W. Lee,Fan-Out Wafer-Level Packaging for Heterogeneous Integration,"IEEE Transactions on Components, Packaging and Manufacturing Technology",2156-3950,Institute of Electrical and Electronics Engineers (IEEE),2018-09,8,9,1544-1560,https://cir.nii.ac.jp/crid/1363107368596660864,https://doi.org/10.1109/tcpmt.2018.2848649