著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
C. Gillot and C. Schaeffer and C. Massit and L. Meysenc,Double-sided cooling for high power IGBT modules using flip chip technology,IEEE Transactions on Components and Packaging Technologies,1521-3331,Institute of Electrical and Electronics Engineers (IEEE),2001,24,4,698-704,https://cir.nii.ac.jp/crid/1363107370108062080,https://doi.org/10.1109/6144.974963