著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Tsuyoshi Kamimura and Satomi Kawamoto and Daisuke Hashimoto and Yuto Shigeno and Haruyuki Yoshii and Hirokazu Noma and Tomohiro Ookubo and Hisato Takahashi and Hidetoshi Inoue,Development of Liquid Compression Molding (LCM) Material for Low Warpage,International Symposium on Microelectronics,2380-4505,IMAPS - International Microelectronics Assembly and Packaging Society,2017-10-01,2017,1,000025-000028,https://cir.nii.ac.jp/crid/1363388843373265024,https://doi.org/10.4071/isom-2017-tp14_157