{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1363388844822504832.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.1108/09540910010331428"}},{"identifier":{"@type":"URI","@value":"https://www.emerald.com/insight/content/doi/10.1108/09540910010331428/full/xml"}},{"identifier":{"@type":"URI","@value":"https://www.emerald.com/insight/content/doi/10.1108/09540910010331428/full/html"}}],"dc:title":[{"@value":"Viscoplastic Anand model for solder alloys and its application"}],"description":[{"type":"abstract","notation":[{"@value":"<jats:p>A viscoplastic constitutive model, the Anand model, in which plasticity and creep are unified and described by the same set of flow and evolutionary relations, was applied to represent the inelastic deformation behavior for solder alloys. After conducting creep tests and constant strain rate tests, the material parameters for the Anand model of the Pb‐rich content solder 92.5Pb5Sn2.5Ag were determined from the experimental data using a nonlinear fitting method. The material parameters for 60Sn40Pb, 62Sn36Pb2Ag and 96.5Sn3.5Ag solders were fitted from the conventional model in the literature where plasticity and creep are artificially separated. Model simulations and verifications reveal that there is good agreement between the model predictions and experimental data. Some discussion on this unified model is also presented. This viscoplastic constitutive model for solder alloys possesses some advantages over the separated model. The achieved Anand model has been applied in finite element simulation of stress/strain responses in solder joints for chip component, thin quad flat pack and flip‐chip assembly. The simulation results are in good agreement with the results in the literature. It is concluded that the Anand model could be recommended as a useful material model for solder alloys and can be used in the finite element simulation of solder joint reliability in electronic packaging and surface mount technology.</jats:p>"}]}],"creator":[{"@id":"https://cir.nii.ac.jp/crid/1383388844822504836","@type":"Researcher","foaf:name":[{"@value":"Z.N. Cheng"}]},{"@id":"https://cir.nii.ac.jp/crid/1383388844822504835","@type":"Researcher","foaf:name":[{"@value":"G.Z. Wang"}]},{"@id":"https://cir.nii.ac.jp/crid/1383388844822504832","@type":"Researcher","foaf:name":[{"@value":"L. Chen"}]},{"@id":"https://cir.nii.ac.jp/crid/1383388844822504834","@type":"Researcher","foaf:name":[{"@value":"J. Wilde"}]},{"@id":"https://cir.nii.ac.jp/crid/1383388844822504833","@type":"Researcher","foaf:name":[{"@value":"K. Becker"}]}],"publication":{"publicationIdentifier":[{"@type":"PISSN","@value":"09540911"}],"prism:publicationName":[{"@value":"Soldering & Surface Mount Technology"}],"dc:publisher":[{"@value":"Emerald"}],"prism:publicationDate":"2000-08-01","prism:volume":"12","prism:number":"2","prism:startingPage":"31","prism:endingPage":"36"},"reviewed":"false","dc:rights":["https://www.emerald.com/insight/site-policies"],"url":[{"@id":"https://www.emerald.com/insight/content/doi/10.1108/09540910010331428/full/xml"},{"@id":"https://www.emerald.com/insight/content/doi/10.1108/09540910010331428/full/html"}],"createdAt":"2002-07-27","modifiedAt":"2025-07-25","relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1360847874821991808","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Effect of viscoelasticity of ethylene vinyl acetate encapsulants on photovoltaic module solder joint degradation due to thermomechanical fatigue"}]},{"@id":"https://cir.nii.ac.jp/crid/1390282680392380288","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Fatigue Life Estimation of Lead-Free Solder Joints Using Viscoplastic-Creep Separate Constitutive Model"},{"@language":"ja","@value":"粘塑性·クリープ分離型構成モデルを用いた鉛フリーはんだ接合部の疲労寿命評価"},{"@value":"粘塑性・クリープ分離型構成モデルを用いた鉛フリーはんだ接合部の疲労寿命評価"},{"@language":"ja-Kana","@value":"ネンソセイ ・ クリープ ブンリガタ コウセイ モデル オ モチイタ ナマリ フリーハンダセツゴウブ ノ ヒロウ ジュミョウ ヒョウカ"}]},{"@id":"https://cir.nii.ac.jp/crid/1390564238059206656","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"The Influences Which Constitutive Models for Lead-Free Solder Alloys in General FEA Programs Give to Accumulated Inelastic Strain Behavior"},{"@language":"ja","@value":"鉛フリーはんだに適用される汎用FEAソフトの構成モデルが累積非弾性ひずみ挙動に及ぼす影響"},{"@language":"ja-Kana","@value":"ナマリ フリーハンダ ニ テキヨウ サレル ハンヨウ FEA ソフト ノ コウセイ モデル ガ ルイセキ ヒダンセイヒズミ キョドウ ニ オヨボス エイキョウ"}]}],"dataSourceIdentifier":[{"@type":"CROSSREF","@value":"10.1108/09540910010331428"},{"@type":"CROSSREF","@value":"10.7791/jspmee.5.266_references_DOI_Pz8RatC58QVwfTafTAN9gyoTJkA"},{"@type":"CROSSREF","@value":"10.7567/jjap.57.08rg03_references_DOI_Pz8RatC58QVwfTafTAN9gyoTJkA"},{"@type":"CROSSREF","@value":"10.7791/jspmee.3.218_references_DOI_Pz8RatC58QVwfTafTAN9gyoTJkA"}]}