著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Yuichi Yoshino and Hidehiko Ohtsu and Takashi Shibata,Thermally Induced Failure of Copper‐Bonded Alumina Substrates for Electronic Packaging,Journal of the American Ceramic Society,0002-7820,Wiley,1992-12,75,12,3353-3357,https://cir.nii.ac.jp/crid/1363388845359185280,https://doi.org/10.1111/j.1151-2916.1992.tb04433.x