{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1363670320074556928.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.1039/c7ra01005b"}},{"identifier":{"@type":"URI","@value":"http://pubs.rsc.org/en/content/articlepdf/2017/RA/C7RA01005B"}},{"identifier":{"@type":"HANDLE","@value":"2115/66403"}}],"dc:title":[{"@value":"Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns"}],"description":[{"type":"abstract","notation":[{"@value":"<p> An alkylamine is added to stabilize the thermal decomposition process and to improve the surface morphology of printed patterns. The adhesion and mechanical stability of the copper thin films are also investigated.</p>"}]}],"creator":[{"@id":"https://cir.nii.ac.jp/crid/1383670320074556800","@type":"Researcher","foaf:name":[{"@value":"Kuan-Ming Huang"}],"jpcoar:affiliationName":[{"@value":"Department of Chemical Engineering"},{"@value":"National Taiwan University"},{"@value":"Taipei"},{"@value":"Taiwan"}]},{"@id":"https://cir.nii.ac.jp/crid/1383670320074556928","@type":"Researcher","foaf:name":[{"@value":"Hiroki Tsukamoto"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1383670320074556929","@type":"Researcher","foaf:name":[{"@value":"Yingqiong Yong"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1383670320074556930","@type":"Researcher","foaf:name":[{"@value":"Hsien-Lung Chiu"}],"jpcoar:affiliationName":[{"@value":"Department of Chemical Engineering"},{"@value":"National Taiwan University"},{"@value":"Taipei"},{"@value":"Taiwan"}]},{"@id":"https://cir.nii.ac.jp/crid/1383670320074556931","@type":"Researcher","foaf:name":[{"@value":"Mai Thanh Nguyen"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1383670320074556932","@type":"Researcher","foaf:name":[{"@value":"Tetsu Yonezawa"}],"jpcoar:affiliationName":[{"@value":"Division of Materials Science and Engineering"},{"@value":"Hokkaido University"},{"@value":"Sapporo"},{"@value":"Japan"}]},{"@id":"https://cir.nii.ac.jp/crid/1383670320074556933","@type":"Researcher","foaf:name":[{"@value":"Ying-Chih Liao"}],"jpcoar:affiliationName":[{"@value":"Department of Chemical Engineering"},{"@value":"National Taiwan University"},{"@value":"Taipei"},{"@value":"Taiwan"}]}],"publication":{"publicationIdentifier":[{"@type":"EISSN","@value":"20462069"}],"prism:publicationName":[{"@value":"RSC Advances"}],"dc:publisher":[{"@value":"Royal Society of Chemistry (RSC)"}],"prism:publicationDate":"2017","prism:volume":"7","prism:number":"40","prism:startingPage":"25095","prism:endingPage":"25100"},"reviewed":"false","dcterms:accessRights":"http://purl.org/coar/access_right/c_abf2","url":[{"@id":"http://pubs.rsc.org/en/content/articlepdf/2017/RA/C7RA01005B"}],"createdAt":"2017-05-10","modifiedAt":"2024-04-17","foaf:topic":[{"@id":"https://cir.nii.ac.jp/all?q=501","dc:title":"501"},{"@id":"https://cir.nii.ac.jp/all?q=620","dc:title":"620"}],"relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1361131415899478272","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Enhanced flexibility and environmental durability of copper electrode produced with conductive ink containing silane coupling agents with diamine and ether spacer"}]},{"@id":"https://cir.nii.ac.jp/crid/1362257544137099392","@type":"Article","resourceType":"学術雑誌論文(journal article)","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@value":"Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light"}]},{"@id":"https://cir.nii.ac.jp/crid/1390579067706961280","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Electro-conductive Inks and Pastes:Preparation and Structural Analyses"},{"@language":"ja","@value":"濃厚分散系としての導電インク・ペーストの作製および 微細構造検証"}]},{"@id":"https://cir.nii.ac.jp/crid/1390854882571918592","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Copper Materials for Low Temperature Sintering"}]}],"dataSourceIdentifier":[{"@type":"CROSSREF","@value":"10.1039/c7ra01005b"},{"@type":"OPENAIRE","@value":"doi_dedup___::61ab1f4bf47c0468772b3b27898cbe95"},{"@type":"CROSSREF","@value":"10.2320/matertrans.mt-n2021004_references_DOI_10QRL1V6XXse4R4voaitvoRYK1Y"},{"@type":"CROSSREF","@value":"10.11618/adhesion.56.207_references_DOI_10QRL1V6XXse4R4voaitvoRYK1Y"},{"@type":"CROSSREF","@value":"10.1007/s10854-019-01571-y_references_DOI_10QRL1V6XXse4R4voaitvoRYK1Y"},{"@type":"CROSSREF","@value":"10.3390/nano9081071_references_DOI_10QRL1V6XXse4R4voaitvoRYK1Y"}]}