著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
M. Erinc and P.J.G. Schreurs and M.G.D. Geers,Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder,Mechanics of Materials,0167-6636,Elsevier BV,2008-10,40,10,780-791,https://cir.nii.ac.jp/crid/1363670320680492800,https://doi.org/10.1016/j.mechmat.2008.04.005