Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
G. Izuta and T. Tanabe and K. Suganuma,Simplified Measuring Method of Copper Concentration in Solder Bath Utilizing Copper Dissolution,IEEE Transactions on Electronics Packaging Manufacturing,1521-334X,Institute of Electrical and Electronics Engineers (IEEE),2009-07,32,3,138-143,https://cir.nii.ac.jp/crid/1363670320697195648,https://doi.org/10.1109/tepm.2009.2021259