著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Y. S. Kim and S. Kodama and Y Mizushima and T. Nakamura and N. Maeda and K. Fujimoto and A. Kawai and K. Arai and T. Ohba,A robust wafer thinning down to 2.6-μm for bumpless interconnects and DRAM WOW applications,2015 IEEE International Electron Devices Meeting (IEDM),,IEEE,2015-12,,,,https://cir.nii.ac.jp/crid/1364233268477121280,https://doi.org/10.1109/iedm.2015.7409653