著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
H. Kitada and N. Maeda and K. Fujimoto and K. Suzuki and A. Kawai and K. Arai and T. Suzuki and T. Nakamura and T. Ohba,Stress sensitivity analysis on TSV structure of wafer-on-a-wafer (WOW) by the finite element method (FEM),2009 IEEE International Interconnect Technology Conference,,IEEE,2009-06,,,,https://cir.nii.ac.jp/crid/1364233269525954304,https://doi.org/10.1109/iitc.2009.5090354