著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Brook Chao and Seung-Hyun Chae and Xuefeng Zhang and Kuan-Hsun Lu and Jay Im and P.S. Ho,Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing,Acta Materialia,1359-6454,Elsevier BV,2007-05,55,8,2805-2814,https://cir.nii.ac.jp/crid/1364233270750953728,https://doi.org/10.1016/j.actamat.2006.12.019