著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Yi-Chieh Tsai and Chia-Hsuan Lee and Hsin-Chi Chang and Jui-Han Liu and Han-Wen Hu and Hiroyuki Ito and Young Suk Kim and Takayuki Ohba and Kuan-Neng Chen,Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via,IEEE Transactions on Electron Devices,0018-9383,Institute of Electrical and Electronics Engineers (IEEE),2021-07,68,7,3520-3525,https://cir.nii.ac.jp/crid/1364233271053967104,https://doi.org/10.1109/ted.2021.3082497