著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
D.C. Katsis and J.D. van Wyk,Void-induced thermal impedance in power semiconductor modules: Some transient temperature effects,IEEE Transactions on Industry Applications,0093-9994,Institute of Electrical and Electronics Engineers (IEEE),2003-09,39,5,1239-1246,https://cir.nii.ac.jp/crid/1364233271273507840,https://doi.org/10.1109/tia.2003.816527