著者名,タイトル,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Park,Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration,,,,2013,,,1988,https://cir.nii.ac.jp/crid/1370288393917211403,