著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Uenishi Keisuke and Saeki Toshio and Kohara Yasuhiro and Kobayashi Kojiro F. and Shoji Ikuo and Nishiura Masataka and Yamamoto Masaharu,Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pad,MATERIALS TRANSACTIONS,13459678,公益社団法人 日本金属学会,2001,42,5,756-760,https://cir.nii.ac.jp/crid/1390001204247684736,https://doi.org/10.2320/matertrans.42.756