Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yamaguchi Takuto and Ikeda Osamu and Hata Shohei and Oda Yuichi and Kuroki Kazuma,Cu-Coated Zn/Al Clad Solder for High Temperature Die Attachment,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2013,16,6,477-483,https://cir.nii.ac.jp/crid/1390001204560426112,https://doi.org/10.5104/jiep.16.477