Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Umeda Yasushi and Nomura Taro and Nakagawa Haruyo and Nakabayashi Yuki and Tashiro Katsuhiko and Honma Hideo and Takai Osamu,High Adhesion Plating Process for ABS Resin using Ultrafine Bubble with Low Ozonated Water,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2016,19,7,492-500,https://cir.nii.ac.jp/crid/1390001204561002368,https://doi.org/10.5104/jiep.19.492