Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
MIZUMOTO Shogo,Trend of BGACSPKGD. Trend of Build up PCB for CSP Mother Board Application.,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,1998,1,5,414-418,https://cir.nii.ac.jp/crid/1390001204561155456,https://doi.org/10.5104/jiep.1.414