Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
TOMITA Yoshihiro and ANDO Tatsuya and TANAKA Naotaka and SATO Tomotoshi and TAKAHASHI Kenji,Feasibilities on Microthin Underfill Technologies for Gap Less than 10.MU.m Applied to Flip-Chip Bonding in 20.MU.m Pitch.,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2001,4,7,607-614,https://cir.nii.ac.jp/crid/1390001204561453184,https://doi.org/10.5104/jiep.4.607