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- KAGA Yasuhisa
- Ecology & Energy Laboratory, Furukawa Electric Co., Ltd. Graduate School, Yokohama National University
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- YU Qiang
- Department of Mechanical Engineering and Materials Science, Yokohama National University
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- SHIRATORI Masaki
- Department of Mechanical Engineering and Materials Science, Yokohama National University
Bibliographic Information
- Other Title
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- 統計的設計システムを用いた有限要素法によるアンダーフィル実装構造の熱疲労信頼性評価
Description
Recently, the underfill mount structure is noticed. However, the sufficient thermal fatigue reliability evaluation has not been established. In this study, the authors proposed a simple reliability evaluation method using Finite Element Analysis (FEA) . In addition, an approximate calculating method for the reliability evaluation parameter (Total equivalent inelastic strain range) was developed using Statistical Design Support System (SDSS) .
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 3 (7), 585-591, 2000
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390001204561547136
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- NII Article ID
- 130004165813
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- ISSN
- 1884121X
- 13439677
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed