Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
今関 貞夫,第19/20回回路実装学会セミナー高密度実装時代の最新技術,The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits,1341-0571,The Japan Institute of Electronics Packaging,1995,10,7,486-487,https://cir.nii.ac.jp/crid/1390001204666818816,https://doi.org/10.5104/jiep1995.10.486