著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Ohba Takayuki and Kim Youngsuk and Mizushima Yoriko and Maeda Nobuhide and Fujimoto Koji and Kodama Shoichi,Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation,IEICE Electronics Express,1349-2543,一般社団法人 電子情報通信学会,2015,12,7,20152002-20152002,https://cir.nii.ac.jp/crid/1390001205212776192,https://doi.org/10.1587/elex.12.20152002