Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
YAMADA Keiji and MORITA Seiichi and UEDA Takashi and HOSOKAWA Akira and TANAKA Ryutaro,Study on Cleaving Process of Silicon Wafer with Nd:YAG Laser,"Journal of the Japan Society for Precision Engineering, Contributed Papers",1348-8724,The Japan Society for Precision Engineering,2006,72,3,393-397,https://cir.nii.ac.jp/crid/1390001205281755776,https://doi.org/10.2493/jspe.72.393