著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Enami Toshio and Horiuchi Osamu and Han Young-Gun and Tomokage Hajime,Evaluation of Relationship between Residual Stress on Chip Using Non-Conductive Film and Package Warpage Caused by Flip-Chip Bonding Process Using Test Element Group Chips with Piezoresistive Sensors,Transactions of The Japan Institute of Electronics Packaging,1883-3365,一般社団法人エレクトロニクス実装学会,2016,9,0,E16-004-1,https://cir.nii.ac.jp/crid/1390001205314178048,https://doi.org/10.5104/jiepeng.9.e16-004-1