Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Kameyama Shuichi and Baba Masayuki and Higami Yoshinobu and Takahashi Hiroshi,Measuring Method for TSV-based Interconnect Resistance in 3D-SIC by Embedded Analog Boundary-Scan Circuit,Transactions of The Japan Institute of Electronics Packaging,1883-3365,The Japan Institute of Electronics Packaging,2014,7,1,140-146,https://cir.nii.ac.jp/crid/1390001205314283904,https://doi.org/10.5104/jiepeng.7.140