Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Suzuki Takashi and Tamura Toshio and Fujisaki Atsushi and Koiwa Kentaro and Yamada Tadaaki and Wakuda Yohei and Ando Satoshi and Matsuno Akira and Koiwa Ichiro,Multi-Chip Module Fabricated by W-CSP Method using Excimer Laser Via-Hole Formation and Cu Plating,Transactions of The Japan Institute of Electronics Packaging,1883-3365,The Japan Institute of Electronics Packaging,2009,2,1,5-12,https://cir.nii.ac.jp/crid/1390001205315252992,https://doi.org/10.5104/jiepeng.2.5