Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
LUO Xu and MIZOGUCHI Masahide and KOKUBO Kunio,Improving Reliability of Solder Joint by Means of Optimizing Underfill Properties,"Journal of the Society of Materials Science, Japan",05145163,"The Society of Materials Science, Japan",2010,59,9,699-704,https://cir.nii.ac.jp/crid/1390001205419353216,https://doi.org/10.2472/jsms.59.699