Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yazaki Yoshitaro and Yokochi Tomohiro and Kondou Kouji,The Development of PALAP substrate by using diffusion bonding technology,Proceedings of JIEP Annual Meeting,13424114,The Japan Institute of Electronics Packaging,2005,19,0,127-128,https://cir.nii.ac.jp/crid/1390001205554620672,https://doi.org/10.11486/ejisso.19.0.127.0