Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Sato Yuki and Miura Hideo,Nondestructive Inspection Method for Detecting Open Failures btween a Si Chip and metalic bumps in Flip Chip Assembly Structures by Measurement of Local Deformation of a Si Chip,Proceedings of JIEP Annual Meeting,,The Japan Institute of Electronics Packaging,2005,19,0,73-74,https://cir.nii.ac.jp/crid/1390001205556057472,https://doi.org/10.11486/ejisso.19.0.73.0