Polishing Equipment Behavior in CMP
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- Uneda Michio
- Kanazawa Institute of Technology
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- Takahashi Yoshihiro
- Kanazawa Institute of Technology
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- Maeda Yuki
- Graduate School of Kanazawa Institute of Technology
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- Shibuya Kazutaka
- Fujikoshi Machinery Corp.
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- Nakamura Yoshio
- Fujikoshi Machinery Corp.
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- Ichikawa Daizo
- Fujikoshi Machinery Corp.
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- Ishikawa Ken-ichi
- Kanazawa Institute of Technology
Bibliographic Information
- Other Title
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- CMPにおける研磨装置の挙動解析に関する基礎検討
Description
In CMP, its characteristics are affected by the various mechanical and chemical factors. It is well known that the removal rate decreases with the increase of the polishing time. Therefore, many papers have described the relationship between the removal rate and the pad surface asperity. On the other hand, the vibration phenomena in the polishing apparatus are important information for estimating the polishing characteristics. This paper aims to demonstrate the effect of the vibration phenomena on the removal rate in Si-CMP. As a result, the following points were observed. (1) The vibration acceleration increases with the increase of the polishing time. (2) The pad deteriorates by the progress in the polishing so that the number of contact points decreases and the spacing of contact points increases. (3) The removal rate decreases with increase of the vibration acceleration.
Journal
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- Proceedings of JSPE Semestrial Meeting
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Proceedings of JSPE Semestrial Meeting 2013S (0), 643-644, 2013
The Japan Society for Precision Engineering
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Keywords
Details 詳細情報について
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- CRID
- 1390001205655872000
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- NII Article ID
- 130005031915
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles
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- Abstract License Flag
- Disallowed