Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Tei Kunio and Suzuki Ken and Miura Hideo,Investigation of the dominant factors of the strength of a grain boundary in a copper thin film,The Proceedings of Autumn Conference of Tohoku Branch,2424-2721,The Japan Society of Mechanical Engineers,2016,2016.52,0,215,https://cir.nii.ac.jp/crid/1390001205850889472,https://doi.org/10.1299/jsmetohoku.2016.52.215