Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Takagi Hideki and Maeda Ryutaro and Chung Teak Ryong and Hosoda Naoe and Suga Tadatomo,Effect of Surface Roughness on Room-Temperature Wafer Bonding by Ar Beam Surface Activation,Japanese Journal of Applied Physics,00214922,The Japan Society of Applied Physics,1998,37,7A,4197-4203,https://cir.nii.ac.jp/crid/1390001206270116736,https://doi.org/10.1143/jjap.37.4197