Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
重藤 暁津 and 付 偉欣 and 水野 潤 and 庄子 習一,Low Temperature Hybrid Bonding Without Vacuum Atmosphere for Future Bioelectronics Packaging,Proceedings of Microelectronics Symposium,2434-396X,The Japan Institute of Electronics Packaging,2016,26,0,251-254,https://cir.nii.ac.jp/crid/1390001277398402432,https://doi.org/10.11486/mes.26.0_251