{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1390004222629909120.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.4139/sfj.71.277"}},{"identifier":{"@type":"NDL_BIB_ID","@value":"030403274"}},{"identifier":{"@type":"URI","@value":"http://id.ndl.go.jp/bib/030403274"}},{"identifier":{"@type":"URI","@value":"https://ndlsearch.ndl.go.jp/books/R000000004-I030403274"}},{"identifier":{"@type":"URI","@value":"https://www.jstage.jst.go.jp/article/sfj/71/4/71_277/_pdf"}},{"identifier":{"@type":"NAID","@value":"130007920182"}}],"dc:title":[{"@language":"en","@value":"Electroless Copper Plating Process Applicable to Molded Interconnect Device Using Laser Direct Structuring"},{"@language":"ja","@value":"LDSを用いたMIDに適応した無電解めっきプロセス"},{"@language":"ja-Kana","@value":"LDS オ モチイタ MID ニ テキオウ シタ ムデンカイメッキ プロセス"}],"dc:language":"ja","creator":[{"@id":"https://cir.nii.ac.jp/crid/1410004222629909120","@type":"Researcher","personIdentifier":[{"@type":"NRID","@value":"9000410315686"}],"foaf:name":[{"@language":"en","@value":"KITAHARA Yuhei"},{"@language":"ja","@value":"北原 悠平"}],"jpcoar:affiliationName":[{"@language":"ja","@value":"奥野製薬工業㈱ 総合技術研究部"},{"@language":"en","@value":"Research, Okuno Chemical Industries Co., Ltd."}]}],"publication":{"publicationIdentifier":[{"@type":"PISSN","@value":"09151869"},{"@type":"LISSN","@value":"09151869"},{"@type":"EISSN","@value":"18843409"},{"@type":"NDL_BIB_ID","@value":"000000066619"},{"@type":"ISSN","@value":"09151869"},{"@type":"NCID","@value":"AN1005202X"}],"prism:publicationName":[{"@language":"en","@value":"Journal of The Surface Finishing Society of Japan"},{"@language":"ja","@value":"表面技術"},{"@language":"en","@value":"Journal of The Surface Finishing Society of Japan"},{"@language":"ja","@value":"表面技術"},{"@language":"en","@value":"J. Surf. Finish Soc. Jpn."},{"@language":"en","@value":"Journal of the Surface Finishing Society of Japan"}],"dc:publisher":[{"@language":"en","@value":"The Surface Finishing Society of Japan"},{"@language":"ja","@value":"一般社団法人 表面技術協会"}],"prism:publicationDate":"2020-04-01","prism:volume":"71","prism:number":"4","prism:startingPage":"277","prism:endingPage":"281"},"reviewed":"false","url":[{"@id":"http://id.ndl.go.jp/bib/030403274"},{"@id":"https://ndlsearch.ndl.go.jp/books/R000000004-I030403274"},{"@id":"https://www.jstage.jst.go.jp/article/sfj/71/4/71_277/_pdf"}],"availableAt":"2020-04-01","foaf:topic":[{"@id":"https://cir.nii.ac.jp/all?q=Electroless%20Copper%20Plating","dc:title":"Electroless Copper Plating"},{"@id":"https://cir.nii.ac.jp/all?q=Plating%20Catalyst","dc:title":"Plating Catalyst"},{"@id":"https://cir.nii.ac.jp/all?q=Laser%20Patterning","dc:title":"Laser Patterning"},{"@id":"https://cir.nii.ac.jp/all?q=Additive%20Process","dc:title":"Additive Process"},{"@id":"https://cir.nii.ac.jp/all?q=Electroless%20Copper%20Plating","dc:title":"Electroless Copper Plating"},{"@id":"https://cir.nii.ac.jp/all?q=Plating%20Catalyst","dc:title":"Plating Catalyst"},{"@id":"https://cir.nii.ac.jp/all?q=Laser%20Patterning","dc:title":"Laser Patterning"},{"@id":"https://cir.nii.ac.jp/all?q=Additive%20Process","dc:title":"Additive Process"}],"relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1390001204115051904","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Influence of Basic Component of plating Bath. The Role of Electroless Copper Plating Bath Components."},{"@value":"めっきの基本組成の役割　　無電解銅めっき"},{"@language":"ja-Kana","@value":"ムデンカイ ドウメッキ"}]},{"@id":"https://cir.nii.ac.jp/crid/1390001204115654144","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Plating Technologies for Electroplating Industries. Circuit Technologies for 3-D Packaging-Plating Technologies for MID."},{"@value":"エレクトロニクス産業におけるめっき技術　　立体配線技術‐ＭＩＤのめっき技術"},{"@language":"ja-Kana","@value":"リッタイ ハイセン ギジュツ MID ノ メッキ ギジュツ"}]},{"@id":"https://cir.nii.ac.jp/crid/1390001204666662528","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Mechanical Properties of Electroless Copper Deposit"},{"@value":"無電解銅めっきの物性"}]},{"@id":"https://cir.nii.ac.jp/crid/1390282679094209024","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@language":"ja","@value":"無電解銅めっきの現状と将来"},{"@language":"en","@value":"The Present and Future Trends in Electroless Copper Plating"},{"@language":"ja-Kana","@value":"ムデンカイ ドウメッキ ノ ゲンジョウ ト ショウライ"}]},{"@id":"https://cir.nii.ac.jp/crid/1390282679537387008","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@language":"ja","@value":"MID：金属・樹脂複合体が目指すもの"},{"@language":"en","@value":"MID: Potential Application of Manufacturing Technology for Metal-Plastic Complex Structure"},{"@language":"ja-Kana","@value":"MID : キンゾク ・ ジュシ フクゴウタイ ガ メザス モノ"}]}],"dataSourceIdentifier":[{"@type":"JALC","@value":"oai:japanlinkcenter.org:2008066005"},{"@type":"NDL_SEARCH","@value":"oai:ndlsearch.ndl.go.jp:R000000004-I030403274"},{"@type":"CROSSREF","@value":"10.4139/sfj.71.277"},{"@type":"CIA","@value":"130007920182"}]}