Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
村上 朋央 and 木村 美緒 and 青木 拡行 and 西城 信吾 and 濱澤 晃久 and 土屋 薫 and 井口 文明,Effect of heat-treatment on the peeling strength between electroless Cu-Ni alloy plating and polyimide film,Proceedings of Microelectronics Symposium,2434-396X,The Japan Institute of Electronics Packaging,2008,18,0,1D1-1,https://cir.nii.ac.jp/crid/1390006385656677504,https://doi.org/10.11486/mes.18.0_1d1-1