Proposal of thermal resistance calculation method for printed circuit boards with surface-mount components
Bibliographic Information
- Other Title
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- 表面実装部品を搭載したプリント基板の熱抵抗算出手法の提案
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 35 (0), 17A1-01-, 2021
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390010292846568448
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- Text Lang
- ja
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- Data Source
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- JaLC