Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Suzuki Osamu,Stress Analysis of Underfill in Advanced Semiconductor Package Structures,Journal of The Japan Institute of Electronics Packaging,1343-9677,The Japan Institute of Electronics Packaging,2022-09-01,25,6,561-568,https://cir.nii.ac.jp/crid/1390011793672354688,https://doi.org/10.5104/jiep.25.561