Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
SHINADA Takumi and KARIYA Yoshiharu and HARA Hidetoshi and ENOMOTO Toshiaki and YAMAGUCHI Hiroshi and YOSHIDA Takuya,Evaluation of Fatigue Crack Propagation Rate at the Interface between Si Die and Underfill in Real Semiconductor Package Structures,"The Proceedings of Mechanical Engineering Congress, Japan",2424-2667,The Japan Society of Mechanical Engineers,2022,2022,0,J011-08,https://cir.nii.ac.jp/crid/1390014093884292480,https://doi.org/10.1299/jsmemecj.2022.j011-08