Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
HOMMA Soichi and OKADA Daichi and SAWANOBORI Akihito and YAMAMOTO Susumu and IMOTO Takashi and NISHIKAWA Hiroshi,Interfacial Behavior Between Mold Resin and Sputtered Film Deposited on Electromagnetic Shield Packages,Journal of Smart Processing,2186702X,"Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)",2023-09-10,12,5,291-298,https://cir.nii.ac.jp/crid/1390016107129077504,https://doi.org/10.7791/jspmee.12.291