Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
WAKABAYASHI Takeshi,Wafer Level Process for Packaging,Journal of The Surface Finishing Society of Japan,09151869,The Surface Finishing Society of Japan,2016,67,8,409-413,https://cir.nii.ac.jp/crid/1390282679092943360,https://doi.org/10.4139/sfj.67.409