High Purity Cu Deposition from Cu(I) Ion in CuCl-1-Butylpyridinium Chloride Ambient- Temperature Molten Salts-Impurity in the Cu Deposit and Purification of the Melts-

DOI 1 Citations 30 References

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Other Title
  • ＣｕＣｌ‐１‐ブチルピリジニウムクロリド常温型溶融塩中のＣｕ（Ｉ）イオンからの高純度Ｃｕの電析―Ｃｕ電析物への不純物の混入と溶融塩浴の精製―
  • −Impurity in the Cu Deposit and Purification of the Melts−
  • －Cu電析物への不純物の混入と溶融塩浴の精製－

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Description

High purity Cu electrodeposition from a CuCl-1-Butylpyridinium chloride (BPC) ambient-temperature molten salt electrolyte has been investigated. In this study, silver was examined as an impurity. Ag did not electrodeposit in the Cu deposit and the Cu purity was 99.9999%, if the Ag(I) ion concentration was controlled to be less than 10 ppm in the 66.7mol%CuCl-33.3mol%BPC melt and less than 12ppm in the 44.0mol%CuCl-56.0mol%BPC melt. In addition, a method removal of the Ag(I) ion from the melt was studied. The method of refining by galvanostatic electrolysis at a large current density (25mA·cm−2) was effective, and the Ag(I) ion concentration in the melt decreased to lower than 9ppm. Furthermore, the codeposit of Cu with the N included in the BPC, which was the main content in the bath was also examined. The electrodeposition of N was not recognized.<br>

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Details 詳細情報について

  • CRID
    1390282679094484992
  • NII Article ID
    130000149217
  • DOI
    10.4139/sfj.56.151
  • COI
    1:CAS:528:DC%2BD2MXjtFCqtbg%3D
  • ISSN
    18843409
    09151869
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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