著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Shin Young-Eui and Lee Kyung-Woo and Chang Kyong-Ho and Jung Seung-Boo and Jung Jae Pil,Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis,MATERIALS TRANSACTIONS,13459678,公益社団法人 日本金属学会,2001,42,5,809-813,https://cir.nii.ac.jp/crid/1390282679224435968,https://doi.org/10.2320/matertrans.42.809