著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Park Donghyun and Han Kee-Sun and Oh Tae Sung,"Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates(Part 2)Flip-Chip Bonding on Compliant Substrates",MATERIALS TRANSACTIONS,13459678,公益社団法人 日本金属学会,2017,58,8,1217-1222,https://cir.nii.ac.jp/crid/1390282679229596544,https://doi.org/10.2320/matertrans.m2017066