Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
FUKUDA Akira and FUKUDA Tetsuo and HIYAMA Hirokuni and TSUJIMURA Manabu and DOI Toshiro and KUROKAWA Syuhei,The impact of wafer edge profile on polishing performance in silicon wafer manufacturing,Journal of the Japan Society for Abrasive Technology,09142703,The Japan Society for Abrasive Technology,2009,53,2,105-110,https://cir.nii.ac.jp/crid/1390282679309889408,https://doi.org/10.11420/jsat.53.105