The Development of Microchannel Chip Using Chemical Bonding Technique at Room Temperature

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Other Title
  • 化学的手法を用いたマイクロチャンネルチップ低温接合技術
  • カガクテキ シュホウ オ モチイタ マイクロチャンネルチップ テイオン セツゴウ ギジュツ
Published
2002
DOI
  • 10.1541/ieejsmas.122.172
Publisher
The Institute of Electrical Engineers of Japan

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Description

Several bonding techniques for the development of microchannel chip at room temperature were studied. An electrostatic interaction between poly-ion layers with opposite charge and a condensation of silane coupling agent was employed to bond two glass substrates. In former case, the bonding of the substrates was achieved by applying high electrical potential. On the other hand, the condensation of silane coupling agent could bond the two glass substrates at room temperature and atmosphere. It was confirmed that the microchannel developed using the silane coupling agent could work for flow channel without solution leak. Poly(dimethylsiloxane)(PDMS) substrate was also applied for chip development. As a result, it was confirmed that PDMS was a material for easy and rapid fabrication of microchannel chip integrated with film electrodes

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