Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
HATADA Kenzo,Status and Future Trends of Electroless Plating Bumps or UBM Fabrication Technology,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2005,8,4,330-338,https://cir.nii.ac.jp/crid/1390282679536743040,https://doi.org/10.5104/jiep.8.330